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Shenzhen Wisdomshow Technology.Co.,Ltd
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bga rework station
Showing 1 - 10 of 20, total 2 pages [First] [Previous] [
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1
manual hot air and ir bga repair station
Specification: L635*W600*H560mm
Detail: 1.Adopted with linear slide, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability 2.Used high precision temperature control instrument , ...
2
manual optical alignment bga rework system
Specification: L800*W780*H810mm
Detail: 1.Upper and lower hot air heating, which can heat up at the same time from the top of the component to the bottom of the PCB; bottom IR heating, temperature precision controlled in +/-2 degree. 8 segment temperature control an...
3
semi-auto hot air bga repair system
Specification: L850*W750*710
Detail: 1. Touch screen interface and PLC controlling. display 3 temperature curves in any time. The temperature is controlled accurately between -1 degree and 1 degree. 2. 6 segments controlling temperature, which could be controlle...
4
hot air mobile motherboard repair machine
Specification: L300*W350*H480
Detail: Small Size Light Efficient reworking High success rate Easier operation 1、Good quality heating materials produce high temperature wind, accuracy control BGA Soldering and Desoldering 2? segment Rising(dropping)+8 seg...
5
good quality and cost-effective bga/pcb oven
Specification: L327*W200*H110mm
Detail: Specifications: Heating board dimension:L200×W150mm Temperature range:0?400? Environment temperature: ?0?60? Temperature stability: ±2? Heating board material: AL Heating power: 1000w Machine dimension: L3...
6
adjustable bga reball kit
Specification: L80*W80mm
Detail: With aluminum alloy structure, robust and portable. With precision oil bearing for sliding, matching precisely If associate with different sizes of stencil, the performance can be greatly enhanced; wide application
7
hot air and ir vga rework station
Specification: L450*W420*H510
Detail: Features: Two temperature zones heat up independently. Hot air heating in upper zone and IR heating in bottom zone controlled independently. Upper and IR temperature zones heating at the same time and the transverse f...
8
cheap! touch screnn bga reball station
Specification: L635*W600*H560mm
Detail: Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability Equipped with touch panel interface and PLC controllin...
9
hot air bga reball machine
Specification: L300*W350*H480
Detail: Features: Small Size Light Efficient reworking High success rate Easier operation 1、Good quality heating materials produce high temperature wind, accuracy control BGA Soldering and Desoldering 2? segment Rising(drop...
10
hot air and ir bga repair machine
Specification: L620*W750*H700mm
Detail: Specifications 1.Movable lower heating zone 2.Hot air nozzle, customized 3.for laptop,desktop,XBOX360,PS2/3,PSP
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